Mitsubishi plans colloidal silica plant

Mitsubishi Chemical is to establish an ultra-high-purity colloidal silica plant at its site in Kitakyushu, Japan, for use as a raw material for polishing agents in semiconductors. The company makes this material through an integrated manufacturing process using ultra-high-tetramethoxysilane. Commercial operations will begin in October 2028.
 
Colloidal silica is used as a raw material for surface polishing agents for silicon wafers and for chemical mechanical polishing slurries used on the interconnect layers. They make it possible to achieve high material removal rates while simultaneously flattening the surface at the nanoscale, ensuring impurities are removed and minimising scratches when polishing the wafers’ wiring layers.